KOKI Low Melting Point Solder Paste
Low Melting Point Lead Free Solder Paste T4AB58-M742
- Solder alloy composition is Sn0.4Ag57.6Bi
- Koki no-clean LEAD FREE solder paste
- T4AB58-M742 Sn0.4A57.6Bi
Reliable and workable in low temperature reflow
Energy-saving
By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.
■ Electricity consumption / hr.during reflow process(kw)
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile.
A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
■ Joint conditions after reflow
High insulation reliability
The flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization.
TB48-M742・T4AB48/58-M742 produces flux residue with high insulation reliability.
■ Voltage applied SIR
KOKI Low Melting Point Solder Paste
Solder alloy composition is Sn0.4Ag57.6Bi
- PERFECT MELTING and wetting at super fine pitch (>0.4mm pitch) and micro components (>0.3mm dia CSP, 0603 chip).
- Specially formulated flux chemistry ensures extremely LOW VOIDING with CSPs and broad contact area components.
- Conforms to Halogen-free standard (Cl+Br = Less than 1500ppm) BS EN14582.
- Low melting point (138ºC )
| Application | Printing – Stencil | |
| Product | T4AB58-M742 | |
| Alloy | Composition (%) | Sn0.4A57.6Bi |
| Melting point (°C) | 138 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 10.0±1.0 |
| Viscosity*1 (Pa.S) | 190±30 | |
| Copper plate corrosion | Passed | |
| Tack time | > 16 hours | |
| Shelf life (below 10°C) | 6 months | |
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