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Soldering Pastes

Soldering Pastes

Stannol supplies both lead containing and lead-free solder pastes in various particle sizes and packaging (e.g. jars and cartridges) for a wide range of application. We offer eutectic silver containing, low-silver and silver-free solder pastes specifically developed for lead-free application

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  • SOLDER PASTE SP2200

    • Specially developed for use with lead-free alloys
    • Very good printing after printer not used for a long time
    • Reflow possible under air or nitrogen
    • High wet bonding strength for use on high speed mounting machines
    • High open time of the printed circuit board
  • PRODUCT ADVANTAGES

    • REL0 classified No-Clean Solderpaste
    • Excellent stability of viscosity
    • High constant print behavior
    • Smallest amounts of clear residues
    • Perfect wetting with oxygen and nitrogen
    • Minimal appearance of Voids
    • Anti-capillary effects, in particular at QFP components
    • Optimised flux system to powdersizes less or equal type 4
  • PRODUCT ADVANTAGES

    • Broadband solder paste with large process window
    • Very good printing after printer not used for a long time
    • Very good for surfaces with poor wettability
    • Reflow possible under air or nitrogen
    • High wet bonding strength for use on high speed mounting machines

Showing all 3 results