JT JTR-1000 10-Zone Lead-Free Reflow Oven

JTR-1000 Reflow Oven – Nitrogen Reflow Oven

The JT JTR-1000 is a 10-zone inline Lead-Free Hot Air Reflow Oven developed for soldering electronic assemblies in industrial SMT production lines. With 10 independently controlled top heating zones and 10 bottom heating zones, the system enables users to establish a suitable thermal profile for different PCB constructions, component combinations, and lead-free solder pastes.

Its 3890 mm heated section provides greater flexibility in configuring the preheat, soak, and reflow stages. Three top and three bottom cooling zones deliver controlled PCBA cooling after reflow. Temperature management is handled through a PID + SSR architecture combined with a Windows 10 computer and PLC-based control system.

The machine is available as the standard JTR-1000 and as the JTR-1000-N for Nitrogen reflow processes. Multi-layer thermal insulation, a flux collection arrangement, a Rail + Mesh conveyor, and electric rail-width adjustment make the oven suitable for continuous SMT manufacturing where repeatable process control and convenient maintenance are important.

Key Features JTR-1000 Reflow Oven

The 20 independently controlled heating zones provide the flexibility required to configure thermal profiles according to PCB construction, component thermal mass, and solder-paste requirements.

The extended heated section allows more gradual temperature transitions and improved control over board residence time through the preheat, soak, and reflow stages. This is especially valuable for complex PCB assemblies or products with higher thermal mass.

PID control combined with SSR switching supports stable heating-zone management. Four thermocouple wires are provided for thermal-profile recording and evaluation.

The Rail + Mesh configuration supports a range of PCB handling requirements. Conveyor speed is adjustable from 300 to 2000 mm/min, while rail width is adjusted electrically.

The rail undergoes a hardening treatment, while the reinforced main hanging bracket helps reduce rail deformation and the risk of PCB jamming during continuous production.

The multi-layer insulation structure reduces heat transfer from the chamber to the surrounding environment. According to the manufacturer, this design can reduce oven-body surface temperature by approximately 10–20°C.

The cooling and flux collection configuration allows filtered or recovered air to return to the oven chamber. This helps reduce thermal losses and makes flux-system maintenance more convenient.

The forced-air cooling system uses three upper and three lower cooling zones to provide controlled PCB cooling after the reflow stage.

The upper cover opens electrically, providing easier access to internal components for inspection, cleaning, and routine maintenance.

The backup power supply helps PCBs already inside the oven complete their passage safely if the main power supply is interrupted, reducing the risk of thermal damage.

The JTR-1000-N is designed for Nitrogen reflow. Its sealed oven structure limits Nitrogen loss, while a high-precision oxygen analyzer and cooling-water configuration are available as options.

For an SMT line that requires flexible thermal profiling, an extended heating section, and reliable continuous processing, the JTR-1000 combines 10 top and 10 bottom heating zones with PID + SSR control and an adjustable conveyor. Standard, Nitrogen, Dual-Rail, and Wide-Rail configurations also allow the oven to be matched to the product mix and required production capacity.

Application – JTR-1000-N Nitrogen Reflow Oven

• Continuous medium- to high-volume SMT assembly lines
• Lead-free reflow soldering of PCB and PCBA products
• Assemblies with mixed component thermal mass and multi-stage profile requirements
• Industrial, telecommunications, and consumer-electronics manufacturing
• Oxidation-sensitive production using the JTR-1000-N configuration
• Dual-lane or wide-PCB production with the appropriate configuration

Production Advantages – JTR-1000 Lead-Free Reflow Oven

• Greater thermal-profile flexibility through 20 independently controlled top and bottom heating zones
• Stable continuous processing with PID + SSR temperature control
• Adjustable conveyor speed up to 2000 mm/min
• Standard, Nitrogen, Dual-Rail, and Wide-Rail configurations for different line requirements
• Reduced risk of PCB jamming through a hardened rail and reinforced support structure
• Reduced thermal loss through multi-layer insulation and filtered-air recirculation
• Easier service access through the electric cover and maintainable flux collection system

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