TRA RX-330 | Hot-Air Conveyor Reflow Soldering System
SMD Reflow Soldering Machine – TRA RX-300
- Six heating zones: three upper and three lower zones.
- Hot-air circulation with PID closed-loop temperature control.
- Maximum PCB size of 280 × 280 mm and a 300 mm mesh conveyor belt.
- Heating length of 1060 mm with two ventilation cooling zones.
- Temperature setting range from ambient temperature to 400°C.
SMT Reflow Oven | TRA RX-330
TRA Reflow Oven
The TRA RX-330 is a compact conveyor reflow oven for SMD soldering and SMT adhesive curing. Its six heating zones are arranged above and below the PCB, providing separate upper and lower heating stages for preheating, temperature holding and reflow.
The oven combines M-type stainless steel finned heating elements with circulating hot air and multilayer thermal insulation. PID closed-loop control regulates zone temperatures, while the variable-speed mesh conveyor allows the heating exposure to be adjusted for the assembly being processed.
SMD Reflow Soldering Machine
With a maximum PCB size of 280 × 280 mm, a heating length of 1060 mm and machine dimensions of 2100 × 680 × 1200 mm, the RX-330 offers a compact reflow solution for compatible SMT assemblies. Temperature-profile measurement and stored temperature recipes support process setup and repeat jobs. Each production profile should be validated against the solder paste or adhesive requirements and the thermal limits of the PCB assembly.
Key Features for – SMT Reflow Oven RX-330 TRA
Six Upper and Lower Heating Zones
Three upper zones and three lower zones provide preheating, temperature holding and soldering stages. Separate temperature settings allow the heating process to be adapted to the assembly.
Hot-Air Circulation and Finned Heating Elements
M-type stainless steel finned heating elements work with the hot-air circulation system to transfer heat to the workpiece. The manual describes a heat-storage structure and multilayer insulation designed to limit heat loss.
PID Closed-Loop Temperature Control
The control system regulates zone temperatures using PID closed-loop calculation. Operators can enter setpoints and monitor measured temperatures through the control interface.
Adjustable Mesh Conveyor
A 300 mm mesh belt carries PCBs up to 280 × 280 mm. Conveyor speed is adjustable through the control interface, allowing the residence time to be matched to the required thermal profile.
Temperature-Profile Measurement
The supplied temperature-profile sensor can be attached to a representative board to record temperature changes as it travels through the oven. The resulting curve helps operators evaluate and adjust the process.
Temperature Recipe Storage and Recall
The recipe function stores groups of temperature settings for later retrieval. This supports repeat production without manually re-entering every zone temperature.
Two Ventilation Cooling Zones
Ventilation cooling follows the heating process to cool the assembly after reflow.
Overtemperature Alarm
An adjustable temperature-deviation threshold activates an audible alarm and red indicator when a zone exceeds the permitted deviation.
Delayed Shutdown
The shutdown sequence stops heating first while other functions continue for the configured delay. This supports cooling before the machine is fully switched off.
Applications – SMT Reflow Oven RX-330
- Reflow soldering of SMD assemblies within the specified PCB size.
- Thermal curing of compatible SMT adhesives using a validated curing profile.
- Process development and repeat production requiring temperature-profile measurement and reusable temperature settings.
Production Advantages TRA 6-Zone Hot Air Reflow Oven
- Compact equipment layout: The 2100 × 680 mm machine plan dimensions help with space planning; installation and maintenance clearances must be added.
- Flexible thermal setup: Upper and lower zone settings and adjustable conveyor speed allow the process to be tuned for different assemblies.
- Repeatable setup: Stored temperature recipes simplify returning to previously validated jobs.
- Measured process adjustment: The profile sensor provides board-temperature data for evaluating the actual heating cycle.
- Controlled cooldown: Ventilation cooling and delayed shutdown support cooling during production and at the end of a run.
Technical Data Hot Air Reflow Oven
| Parameter | TRA RX-330 |
| Machine type | hot-air reflow oven |
| Heating zones | 6 total: 3 upper + 3 lower |
| Heating method | Hot-air circulation |
| Cooling zones | 2 ventilation cooling zones |
| Heating length | 1060 mm |
| Maximum PCB dimensions | 280 × 280 mm |
| Conveyor type | Mesh belt |
| Mesh belt width | 300 mm |
| Conveyor height | 900 ± 20 mm |
| Conveyor drive | Variable-frequency drive |
| Conveyor direction | Left to right; right-to-left arrangement also listed in the manual |
| Temperature control range | Ambient temperature to 400°C |
| Temperature control | PID closed-loop control; touch-screen control listed in the specification table |
| Starting power | 9 kW |
| Operating power | 3 kW, as listed in the manual; actual consumption depends on process conditions |
| Warm-up time | Approximately 20 min |
| Passage time | 3.5–5.5 min, as listed in the manual; dependent on process settings |
| Overall dimensions | 2100 × 680 × 1200 mm |
| Machine weight | 215 kg |
| Operating ambient temperature | 5–40°C |
| Operating relative humidity | 20–95% |
| Temperature-profile measurement | Sensor included |
| Recipe function | Storage and recall of temperature settings |
| Alarm | Audible and visual overtemperature indication |
| Shutdown | Configurable delayed shutdown |
Download Datasheet
| Brand | TRA |
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