JT JTR-1200 12-Zone Lead-Free Reflow Oven

JTR-1200 Reflow Oven | JT 12-zone reflow oven

JT 12-zone reflow oven

The JT JTR-1200 Reflow Oven is an inline lead-free hot-air soldering system for SMT production lines. Equipped with 12 upper and 12 lower heating zones, it provides a multi-zone heating arrangement for developing thermal profiles according to PCB construction, component thermal mass, and solder-paste requirements.

Its 4640 mm heated section provides space for managing the preheat, soak, and reflow stages. Conveyor speed is adjustable from 300 to 2000 mm/min, allowing process engineers to coordinate board residence time with the required soldering profile. Three upper and three lower cooling zones follow the heating section.

JTR-1200-N Nitrogen reflow oven

The system combines PID + SSR temperature control, computer and PLC operation, production-parameter storage, and audible and visual temperature alarms. A Rail + Mesh conveyor, electric rail-width adjustment, reinforced rail supports, and an electrically opening upper cover support daily operation and maintenance.

The standard JTR-1200 is intended for air reflow, while the JTR-1200-N provides a Nitrogen configuration. Additional D-series dual-lane and L-series wide-board versions allow the oven configuration to be selected according to PCB dimensions and production-line requirements.

Key Features JTR 1200 Reflow Soldering

The oven incorporates 12 upper and 12 lower heating zones. This arrangement provides flexibility when developing temperature profiles for assemblies with different board constructions and component heat capacities.

The extended heating section supports the development of multi-stage reflow profiles. Together with adjustable conveyor speed, it allows engineers to establish the required heating duration for a particular PCB assembly and solder paste.

PID regulation with solid-state relay switching manages the heating process. The control architecture supports adjustment of process settings for different production requirements.

The brochure specifies a Windows 10 computer and PLC control system. Production parameters and operating status can be stored for reference and subsequent setup.

The conveyor combines rail and mesh transport. Its speed can be adjusted from 300 to 2000 mm/min, while electric rail-width adjustment simplifies setup for different PCB widths.

The reinforced main support bracket is designed to limit rail deformation and reduce the risk of board jamming. The conveyor also uses a dual-link chain structure intended to improve board transport reliability.

Multi-layer insulation limits heat transfer from the process chamber to the machine exterior. This helps reduce thermal losses and heat released into the surrounding production area.

The brochure describes a cooling arrangement that returns filtered or recovered process air to the chamber. This design supports flux collection while reducing heat loss associated with exhausted process air.

The cooling section contains three top and three bottom zones for cooling assemblies after reflow. The cooling method depends on the selected machine configuration.

The upper cover opens electrically, providing access to the oven interior for cleaning, inspection, and routine maintenance.

Audible and visual alarms indicate over-temperature and under-temperature conditions. A backup UPS is included to support completion of PCB transport during a power interruption.

The JTR-1200-N uses a sealed chamber arrangement intended to limit Nitrogen loss. An optional Nitrogen closed-loop control system is described in the supplied brochure.

The JT JTR-1200 is a suitable choice for SMT manufacturers requiring a long heating section, flexible thermal-profile setup, and continuous inline PCB transport. Its 12 top and 12 bottom heating zones, PID + SSR control, and adjustable conveyor provide the principal tools needed to establish a repeatable reflow process.

The availability of Nitrogen, dual-lane, and wide-board versions also allows the machine to be matched to the intended product range and production-line layout.

Applications – JT reflow soldering machine

• Lead-free inline SMT soldering.
• PCB assemblies requiring multi-stage thermal profiles.
• Continuous production with different board and component thermal characteristics.
• Nitrogen reflow with the appropriate N-series configuration.
• Dual-lane or wide-board production with the corresponding model.

Production Advantages – JTR 1200 Reflow Oven

• Flexible thermal-profile setup through an extended heating section.
• Adjustable conveyor speed and electric rail-width adjustment.
• Reinforced rail supports to reduce board transport interruptions.
• Multi-layer insulation to help reduce thermal losses.
• Electric cover opening for convenient maintenance.
• Multiple configurations for different PCB widths and line arrangements.