TRA MX-500 | Automatic Solder Paste Mixer

MX-500 Solder Paste Mixer

SMT Solder Paste Mixer

The TRA MX-500 is an automatic solder paste mixer designed for paste preparation before SMT stencil printing. It combines revolution and rotation to mix solder paste inside its closed container, providing a timed mechanical preparation process with less dependence on manual stirring.

The jar holders are inclined at 45°. The combined motion circulates the paste within each jar, supporting mixing and softening. The catalogue also describes bubble reduction during mixing. These effects support paste preparation, but the resulting condition depends on the paste formulation, initial condition and selected cycle.

MX-500 Solder Paste Mixer

The machine has two holders for common 500 g jars. It can accommodate two suitably balanced jars or one jar with an appropriate counterweight. A front control panel provides power, start and stop controls together with an adjustable digital timer. The observation window, gas-spring-supported lid and safety switch support practical use at an SMT material-preparation station.

Key Features for TRA MX-500

The mixing mechanism combines 400 rpm revolution with 300 rpm rotation. These are separate motions; the stated 1,350 rpm motor speed is not the jar rotation speed.

Inclined holders support circulation of the paste during mixing. The catalogue describes this arrangement as helping keep paste from accumulating on the jar lid.

The solder paste container remains closed during mixing, avoiding the need to insert a manual stirring tool into the paste.

An LED digital timer allows the operator to set the mixing duration. The machine uses fixed-speed mixing; adjustable time does not imply adjustable speed.

Two jars can be mixed together when their loads are appropriately balanced. For a single jar, the opposite position uses a suitable counterweight according to the manual.

The machine includes a lid safety switch, front locking latches, an observation window and a gas spring supporting the lid. The manual prohibits operation with the cover open or unlocked.

Separate power, start and stop controls keep routine operation straightforward. The catalogue describes stable, low-noise running but supplies no vibration or dB rating.

SMT Solder Paste Mixer

• Solder paste preparation before SMT stencil printing.
• Dedicated paste-preparation stations supporting PCB assembly.
• Electronics production or prototyping environments using compatible jar-packaged solder paste.

Production Advantages Dual-Jar Solder Paste Mixer

• Repeatable timing: A set cycle provides a consistent time parameter for the preparation procedure.
• Reduced manual stirring: Mechanical mixing reduces the need for operators to stir paste by hand.
• Two-jar processing: Two compatible, balanced jars can be prepared in one cycle.
• Closed-container preparation: Mixing takes place without removing the paste jar lid.
• Practical installation: A 400 × 400 × 500 mm enclosure and the specified AC supply suit a dedicated preparation position.

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