KOKI Dispensing SMT Adhesive
KOKI Dispensing type adhesive with no infringement of UN regulations
JU-110
Improved application precision No Un-regulated hazardous substances
Tall deposits ensure contact with components
JU-110 has excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
■ Continual dispensing(φ0.3mm)
Resistant to heat slump
JU-110 is strong against heat slump, maintaining the height of deposits throughout the process. The height of deposits and contact with surface-mounted components are maintained even during heating, securely immobilizing the components.
■ Heat slump test (130℃ 90sec)
High precision continual printing
In addition to its resistance to heat slump, the viscosity of JU-110 is stable at room temperature. Consistent viscosity reduces print clogging and ensures highly precise continual printing.
■ Continual dispensability test
Product Performance Table
| Product Name | JU-110 | Product Category | Heat curing type SMT adhesive | |
| Composition | Epoxy | State / Color | Paste / Red | |
| Viscosity（Pa.s） | 55 | Transition Temperature(℃) | 95 | |
| Curing condition | 130℃ × >60sec. | Shelf life (0-10℃) | Below 10ºC, 6 months |
| Brand |
KOKI |
|---|
You must be logged in to post a review.
Reviews
There are no reviews yet.