TRA DX-350 | Semi-Automatic Dip Soldering Machine

TRA DX-350 | Dip Soldering Machine

  • 350 × 250 × 70 mm solder bath with a nominal 45 kg solder capacity.
  • PID bath temperature control from ambient temperature to 400 °C, with manufacturer-stated control precision of ±1%.
  • Sensor-triggered flux spray with a Danfoss nozzle and a self-priming electromagnetic pump.
  • Integrated preheating, fan-assisted cooling, fume extraction and solder dross collection.
  • Mechanical PCB holder for a semi-automatic workflow designed for one operator.

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Description

TRA DIP Soldering Machine

PCB DIP Soldering Machine

The TRA DX-350 is a semi-automatic dip soldering machine for through-hole technology (THT) PCB assembly. It combines flux application, preheating, immersion in a molten solder bath, cooling and board release in one workstation. The machine is designed for through-hole components with short or long leads.

The operator loads the PCB into an adjustable holder, guides it through fluxing and preheating, then lowers the assembly into the solder bath using the mechanical arm. After soldering, the operator moves the board to the fan-cooled area and uses the arm to release it. The fixture helps maintain the PCB’s angle and height relative to the solder surface during successive cycles.

Electronic PCB Soldering Equipment

The machine fits small- to medium-volume THT production cells with a manual component insertion station. In mixed SMT/THT production, it can serve as a separate workstation for the through-hole soldering step.

Features – DX-350 | Dip Soldering Machine

PCB Holder and Mechanical Arm

The adjustable holder secures the board as the operator moves it between stations. The mechanical arm guides immersion and helps the operator repeat the dipping angle and height across boards using the same setup.

Sensor-Triggered Flux Spray

A Danfoss nozzle atomizes the flux, and a self-priming electromagnetic pump supplies the spray system without an external compressed-air connection. The operator can select automatic spray or manual activation by foot switch. A spray timer lets the operator adjust the duration of automatic application.

PCB Preheating

A separate preheating station prepares the fluxed PCB for contact with molten solder. Preheating supports flux activation and helps evaporate its carrier before dipping.

PID-Controlled Solder Bath

The controller displays the setpoint and measured bath temperature at the same time. The 350 × 250 × 70 mm bath has a nominal solder capacity of 45 kg. The operator selects a process setpoint based on the solder alloy, flux and PCB assembly.

Cooling, Fume Extraction and Dross Collection

Fans cool the PCB after dipping. An integrated exhaust port provides a connection for facility ducting. The solder dross collection tray gives the operator a dedicated place to collect surface oxides removed from the bath.

Applications – DX-350 | Dip Soldering Machine

  • THT assembly of industrial control and power supply PCBs
  • Through-hole soldering on LED driver boards and lighting controls
  • THT production for consumer electronics and contract PCB assembly
  • Pilot builds and small- to medium-volume batches with manual component insertion

Production Advantages | TRA DX-350 – SMT Dip Soldering Machine

  • Repeatable board handling. The holder and arm help maintain immersion geometry across boards of the same type.
  • A defined process sequence. The operator can apply flux, preheat, solder and cool the assembly at one workstation.
  • Visible process settings. Separate setpoint and actual temperature readings let the operator monitor bath conditions during a run.
  • Simple production-cell integration. The flux spray system uses a built-in pump, and the station can be placed downstream of manual THT insertion.

Technical Data | DX-350 PCB Soldering Machine

Parameter TRA DX-350
Process Semi-automatic dip soldering for THT PCB assemblies
Solder bath dimensions 350 × 250 × 70 mm
Nominal solder capacity 45 kg
Bath temperature control range Ambient temperature to 400 °C
Temperature control precision ±1% (manufacturer specification)
Rated power 2,500 W
Power supply 220 V AC ±10%, 50 Hz
Machine dimensions (L × W × H) 1,230 × 800 × 1,160 mm
Net machine weight 101 kg
Flux application Sensor-triggered automatic spray or manual foot-switch activation
Spray system Danfoss nozzle with a self-priming electromagnetic pump
PCB handling Adjustable holder with an operator-guided mechanical arm
Integrated stages PCB preheating, dip soldering and fan-assisted cooling
Other equipment Exhaust port and solder dross collection tray

Download Datasheet

Additional information
BrandTRA
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