TRA RX-635 Inline SMT Reflow Oven

SMT Reflow Oven – TRA RX-635 Hot Air Reflow Oven

12 heating zones arranged as 6 upper and 6 lower zones.
2060 mm heating length and maximum PCB width of 350 mm.
Mesh-belt and rail-conveyor transport with digital speed adjustment.
Touchscreen PID temperature control and automatic chain lubrication.
Three cooling sections for inline PCB soldering.

TRA Reflow Oven Machine

Hot Air Reflow Oven Machine

The TRA RX-635 is an inline Reflow Oven for SMT PCB assembly. Its upper and lower heating zones provide a continuous soldering process after component placement, with mesh and rail transport available for different board-handling requirements.

PCB reflow soldering machine

The machine combines adjustable transport speed with temperature control to establish a profile appropriate to the assembly. It is intended for integration into a production line; board clearance, transfer height and the required soldering profile should be matched to the actual product before configuration is finalized.

SMT Reflow Oven | TRA RX-635

Heating and process adjustment

Upper and lower heating, variable-frequency airflow and adjustable transport speed provide process-setting flexibility. The thermal profile must be validated against the solder paste and component requirements.

Mesh and rail transport

Two conveying methods allow selection of the appropriate board support. Mesh width and permitted PCB width are different specifications; a 450 mm belt does not establish a 450 mm PCB capacity.

Touchscreen operation

Closed-loop PID regulation provides temperature control. The shared model manual also describes recipe recall and temperature-profile measurement using a sensor.

Lubrication and maintenance access

Timed oil dripping supports chain lubrication. The product page describes a split exhaust arrangement, finned heaters and an insulated stainless-steel chamber.

Applications – RX-635 | Reflow Soldering Machine

TRA Reflow Oven Machine, Suitable applications include SMT boards for LED lighting, consumer electronics, industrial controls, telecommunications and smart-home products. Suitability depends on PCB dimensions, component clearance and a validated thermal profile. Industry-specific certification is not implied.

Production Advantages TRA PCB Reflow Soldering Machine

Continuous board flow supports integration after Pick and Place.
Adjustable heating and transport settings support product-specific process setup.
Mesh and rail options offer flexibility in board handling.
Recipe recall supports repeat setup for recurring assemblies.
Automatic oil dripping reduces the need for manual chain oil application.

Technical Data TRA RX-635 Reflow Oven

Parameter	Value
Model	TRA RX-635
Heating zones	6 upper + 6 lower
Heating length	2060 mm
Cooling sections	3
Transport	Mesh belt and rail conveyor
Mesh belt width	450 mm
Maximum PCB width	350 mm
Conveyor speed	160–1350 mm/min
Mesh belt height	880 ±20 mm
Rail conveyor height	900 ±20 mm
Control	Touchscreen, closed-loop PID
Chain lubrication	Timed automatic dripping
Starting power	22 kW
Published operating power	4.5 kW
Dimensions, L × W × H	3380 × 820 × 1360 mm
Net weight	560 kg