TRA RX-35D Desktop Reflow Oven

Desktop Reflow Oven

Benchtop Reflow Oven

The TRA RX-35D is a desktop reflow oven for soldering SMT assemblies in prototypes, engineering samples and small production batches. Its drawer-style chamber provides a 350 × 300 mm effective soldering area, making it a practical choice for teams that need in-house reflow capability within a compact workstation.

The heating system combines infrared radiation with hot-air circulation. Adjustable temperature-profile stages allow the heating cycle to be matched to the solder paste and assembly being processed. Both leaded and lead-free soldering processes are supported, with process settings established for the PCB, components and solder alloy in use.

SMT Reflow Soldering Oven

A Chinese/English LCD interface supports local operation, while PC connectivity enables temperature-curve monitoring. The RX-35D fits electronics development laboratories, training facilities and low-volume assembly environments where board designs and processing requirements change between batches.

Key Features – TRA Reflow Oven | RX-35D

Infrared heaters deliver thermal energy while circulating hot air distributes heat within the chamber. This combination supports batch reflow processing across the specified working area.

The controller provides sequential preheating, heating, soldering, holding/insulation and cooling stages. Profile settings can be adapted to the process instead of relying on a single fixed heating cycle. The stages occur over time within the drawer chamber.

The manufacturer describes thermocouple temperature measurement and microcomputer control. The manual also documents PID parameters and temperature compensation settings for qualified adjustment; it does not establish a numerical temperature-accuracy guarantee.

The display and front-panel buttons provide access to process settings and operating information. Chinese and English language options, together with graph and text modes, support day-to-day operation.

The manual documents a DB9 connection for computer operation and temperature-curve monitoring. Confirm the supplied software, cable/adapter requirements and supported computer environment when ordering.

In addition to reflow operation, the controller includes constant-temperature operation for suitable heating or drying tasks. Application temperature and material compatibility must be assessed for each process.

Documented alarms cover sensor faults, heating faults, heating timeout and excessive temperature relative to configured limits. These alerts help operators identify abnormal process conditions.

The manual describes a coated cold-rolled steel exterior, a 201 stainless-steel inner chamber and thermal insulation. The pull-out drawer provides access for batch loading and unloading.

Applications – TRA RX-35D  Benchtop Reflow Oven

• SMT prototype and engineering-sample assembly.
• Product development and laboratory reflow trials.
• Small-batch PCB production.
• Electronics education and practical SMT training.
• Suitable repair and constant-temperature heating tasks after process validation.

Production Advantages – TRA RX-35D SMT Reflow Soldering Oven

• Reflow capability at the development bench: Process prototype assemblies without allocating a full conveyor reflow line to each trial.
• Flexible batch setup: Adjust the profile for different PCB designs and soldering processes.
• Direct access to assemblies: The drawer arrangement suits manual batch workflows.
• Clear operating feedback: Local display information and PC curve monitoring assist process setup and observation.
• Compact equipment layout: The desktop enclosure can be integrated into a small SMT work area with the installation clearances and exhaust arrangement specified in the manual.

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