JT Smartcell-400 Mini Selective Wave Soldering System
SMT Selective Soldering Equipment – JT Smartcell-400
- Automatic selective soldering for double-sided PCBs.
- Supports PCB sizes from 120 × 60 mm to 400 × 400 mm.
- Selective flux module with 2 L capacity and 2–8 mm flux width.
- Independent top-air and bottom-infrared preheating.
- Gerber and image import with inline/offline programming.
- CCD process visualization and adjustable wave-nozzle movement.
- Maximum soldering temperature of 350°C.
- Compact machine dimensions of 1,650 × 1,800 × 1,650 mm.
JT Mini Selective Soldering
Mini Selective Soldering Machine
The JT Smartcell-400 Mini Selective Wave Soldering System is designed for automatic selective soldering of double-sided PCBs. By integrating selective flux spraying, top-air and bottom-infrared preheating, and a programmable soldering module, the machine applies solder to designated areas of the PCB while maintaining control over the process.
PCB Selective Soldering | Smartcell-400
The Smartcell-400 supports PCB widths from 60 to 400 mm and PCB lengths from 120 to 400 mm. It features Gerber and image import, inline/offline programming, and CCD process visualization. The adjustable wave-nozzle movement and selective flux application help adapt the soldering process to different PCB layouts.
Key Features of JT Smartcell-400
Automatic Double-Sided PCB Soldering
The Smartcell-400 supports automatic selective soldering for double-sided PCBs, applying solder to programmed areas of the assembly.
Selective Flux Spraying
The 2 L flux module uses a selective spray process with a specified flux width of 2–8 mm. A double flux nozzle is available as an option.
Top-Air and Bottom-Infrared Preheating
The preheating system combines a maximum 6 kW top air heater with a maximum 9 kW bottom dynamic infrared heater. Top and bottom preheating temperatures are controlled independently.
Adjustable Wave-Nozzle Movement
The wave-nozzle movement speed can be adjusted according to process requirements. JT also lists online wave-height monitoring and automatic calibration.
CCD Process Visualization
A CCD camera provides visual monitoring of the soldering process during operation.
Gerber Import and Flexible Programming
The control system supports Gerber and image import, as well as inline and offline programming. JT also describes graphic programming for situations where initial PCB data is not available.
Applications – JT Mini Selective Wave Soldering System
The JT Smartcell-400 is intended for PCB assembly processes requiring automatic selective soldering, particularly double-sided PCB assemblies and boards with defined soldering areas. Its Gerber/image import, selective fluxing and CCD process visualization support programmable and monitored soldering operations.
JT Smartcell-400 | PCB Selective Soldering
- Automatic selective soldering for double-sided PCBs.
- Controlled flux application to help reduce unnecessary flux consumption.
- Independent top and bottom preheating.
- Adjustable wave-nozzle movement.
- Gerber and image import with inline/offline programming.
- CCD-based process visualization.
- Integrated fluxing, preheating and soldering functions in one machine.
Technical Data JT Selective Soldering
| Parameter | Specification |
| Model | Smartcell-400 |
| Machine Type | Mini Selective Wave Soldering Machine |
| Machine Dimensions (L × W × H) | 1,650 × 1,800 × 1,650 mm |
| PCB Width | 60–400 mm |
| PCB Length | 120–400 mm |
| PCB Top-Side Clearance | Max. 120 mm |
| PCB Bottom-Side Clearance | Min. 50 mm |
| PCB Edge Clearance | 4 mm |
| Conveyor Height | 900 ± 20 mm |
| Conveyor Speed | 0.2–10 m/min |
| Maximum PCB / Pallet Weight | 5 kg |
| Flux Capacity | 2 L |
| Flux Nozzle Tube Size | 130 μm |
| Flux Width | 2–8 mm |
| Double Flux Nozzle | Optional |
| Bottom Preheating | Dynamic Infrared Heater |
| Bottom Heater Power | Max. 9 kW |
| Top Preheating | Hot Air Heater |
| Top Heater Power | Max. 6 kW |
| Preheating Temperature Range | Room Temperature–250°C |
| Temperature Control Accuracy | ±15°C* |
| Minimum Solder Nozzle Diameter | Φ3/5* |
| Maximum Wave Height | 5 mm |
| Solder Pot Capacity | 8 kg/pot |
| Maximum Soldering Temperature | 350°C |
| Heating Time | 40 min to 300°C |
| Solder Pot Heating Power | 1 kW / Single Pot |
| X/Y Positioning Speed | 2–200 mm/s |
| Z Positioning Speed | 2–50 mm/s |
| Soldering Accuracy | ±0.25 mm* |
| PC Operating System | Windows 10 |
| Process Visualization | CCD |
| Software Language | Chinese / English |
| Data Import | Gerber / Image |
| Programming Mode | Inline / Offline |
| Power Supply | AC 380 V, 3 Phase, 5 Wire, 50/60 Hz |
| Power Consumption | 22 kW |
| Exhaust Duct Diameter | Φ150 mm* |
| Exhaust Air Rate | 360 m³/h |
| Nitrogen Pressure | 0.4–0.8 MPa |
| Nitrogen Consumption | Approx. 1.5–2 m³/h |
| Nitrogen Purity | ≥99.999% |
Download Datasheet
| Brand | JT |
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