VT-S530 | PCB | Automated Optical Inspection (AOI) – OMRON
VT-S530 | PCB | Automated Optical Inspection (AOI) – OMRON
- The New VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero escape and lowest False Rejects amongst other strengths.
- The technology available on the VT-S530 has been proven ultra-performant on the existing models with which it is sharing the new Image-Capture Module.
VT-S530 | PCB | Automated Optical Inspection (AOI) – OMRON
The VT-S530 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called “”color highlight ™ 3D shape reconstruction technology”” for the Best Inspection Quality.
offers a great versatility in application as it can be used on pre or post reflow inspection, Single or Dual lane, it is 01005 compliant and has the possibility to inspect XL boards of 510x680mm.
With the ability to perform pre or post reflow inspection, handle large format samples, and optional dual-lane configuration, the VT-S530 handles any production environment. Built-in 3D and 2D inspection technologies measure ensure every solder joint while adhering to industrial IPC Standards. Additionally, Omron’s completely offline programming and review software guarantee the least amount of process interruption.
| Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
|---|---|---|
| Weight | Approx. 850kg | |
| Power supply | Voltage | 200 – 240VAC (single phase), voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA | |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 – 0.6MPa | |
| Operating temperature range | 10 – 35°C | |
| Operating humidity range | 35 – 80%RH (Non-condensing) | |
| Image signal input block |
Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 10μm/15μm | |
| FOV | 10μ: 40×30mm | |
| 15μ: 60×45mm | ||
| Supported PCB size (min.) | 50(W)×50(D)mm |
|---|---|
| Supported PCB size (max.) | Dual lane: 510(W)×330(D)mm |
| Single lane: 510(W)×680(D)mm | |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25mm |
| Thickness | 0.4 – 4mm |
| Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
- Built Upon a History of Innovation and track record of High-Quality Solutions
- High Speed Top View 12Mpix Camera with Telecentric Lens
- Latest 3D Programmable DLP Projectors (25mm max Height Inspection)
- Omron’s Unique Color-Highlight Illumination Technology
- Single / Dual Lane and Pre / Post Reflow configurations
- Real 3D Image Technology for Component and High-Quality Solder Joint Inspection
- Real-time Interactive 3D data feedback to the Programmer
- View and edit samples of all parts on the board simultaneously (in real-time)
- Process histograms are created automatically for all inspection tests and components
- AI self-optimization tools can perform automated inspection logic and criteria changes
- Real defect images can be stored in the library and used to improve the tuning process
- Consistent and quantitative inspection tests and logic across all component types
- Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution
- Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
| Brand |
OMRON |
|---|
You must be logged in to post a review.
Reviews
There are no reviews yet.