JT Smartcell-400 Mini Selective Wave Soldering System

SMT Selective Soldering Equipment – JT Smartcell-400

  • Automatic selective soldering for double-sided PCBs.
  • Supports PCB sizes from 120 × 60 mm to 400 × 400 mm.
  • Selective flux module with 2 L capacity and 2–8 mm flux width.
  • Independent top-air and bottom-infrared preheating.
  • Gerber and image import with inline/offline programming.
  • CCD process visualization and adjustable wave-nozzle movement.
  • Maximum soldering temperature of 350°C.
  • Compact machine dimensions of 1,650 × 1,800 × 1,650 mm.

Download Datasheet

Description

JT Mini Selective Soldering

Mini Selective Soldering Machine

The JT Smartcell-400 Mini Selective Wave Soldering System is designed for automatic selective soldering of double-sided PCBs. By integrating selective flux spraying, top-air and bottom-infrared preheating, and a programmable soldering module, the machine applies solder to designated areas of the PCB while maintaining control over the process.

PCB Selective Soldering | Smartcell-400

The Smartcell-400 supports PCB widths from 60 to 400 mm and PCB lengths from 120 to 400 mm. It features Gerber and image import, inline/offline programming, and CCD process visualization. The adjustable wave-nozzle movement and selective flux application help adapt the soldering process to different PCB layouts.

Key Features of JT Smartcell-400

Automatic Double-Sided PCB Soldering

The Smartcell-400 supports automatic selective soldering for double-sided PCBs, applying solder to programmed areas of the assembly.

Selective Flux Spraying

The 2 L flux module uses a selective spray process with a specified flux width of 2–8 mm. A double flux nozzle is available as an option.

Top-Air and Bottom-Infrared Preheating

The preheating system combines a maximum 6 kW top air heater with a maximum 9 kW bottom dynamic infrared heater. Top and bottom preheating temperatures are controlled independently.

Adjustable Wave-Nozzle Movement

The wave-nozzle movement speed can be adjusted according to process requirements. JT also lists online wave-height monitoring and automatic calibration.

CCD Process Visualization

A CCD camera provides visual monitoring of the soldering process during operation.

Gerber Import and Flexible Programming

The control system supports Gerber and image import, as well as inline and offline programming. JT also describes graphic programming for situations where initial PCB data is not available.

Applications – JT Mini Selective Wave Soldering System

The JT Smartcell-400 is intended for PCB assembly processes requiring automatic selective soldering, particularly double-sided PCB assemblies and boards with defined soldering areas. Its Gerber/image import, selective fluxing and CCD process visualization support programmable and monitored soldering operations.

JT Smartcell-400 | PCB Selective Soldering

  • Automatic selective soldering for double-sided PCBs.
  • Controlled flux application to help reduce unnecessary flux consumption.
  • Independent top and bottom preheating.
  • Adjustable wave-nozzle movement.
  • Gerber and image import with inline/offline programming.
  • CCD-based process visualization.
  • Integrated fluxing, preheating and soldering functions in one machine.

Technical Data JT Selective Soldering

Parameter Specification
Model Smartcell-400
Machine Type Mini Selective Wave Soldering Machine
Machine Dimensions (L × W × H) 1,650 × 1,800 × 1,650 mm
PCB Width 60–400 mm
PCB Length 120–400 mm
PCB Top-Side Clearance Max. 120 mm
PCB Bottom-Side Clearance Min. 50 mm
PCB Edge Clearance 4 mm
Conveyor Height 900 ± 20 mm
Conveyor Speed 0.2–10 m/min
Maximum PCB / Pallet Weight 5 kg
Flux Capacity 2 L
Flux Nozzle Tube Size 130 μm
Flux Width 2–8 mm
Double Flux Nozzle Optional
Bottom Preheating Dynamic Infrared Heater
Bottom Heater Power Max. 9 kW
Top Preheating Hot Air Heater
Top Heater Power Max. 6 kW
Preheating Temperature Range Room Temperature–250°C
Temperature Control Accuracy ±15°C*
Minimum Solder Nozzle Diameter Φ3/5*
Maximum Wave Height 5 mm
Solder Pot Capacity 8 kg/pot
Maximum Soldering Temperature 350°C
Heating Time 40 min to 300°C
Solder Pot Heating Power 1 kW / Single Pot
X/Y Positioning Speed 2–200 mm/s
Z Positioning Speed 2–50 mm/s
Soldering Accuracy ±0.25 mm*
PC Operating System Windows 10
Process Visualization CCD
Software Language Chinese / English
Data Import Gerber / Image
Programming Mode Inline / Offline
Power Supply AC 380 V, 3 Phase, 5 Wire, 50/60 Hz
Power Consumption 22 kW
Exhaust Duct Diameter Φ150 mm*
Exhaust Air Rate 360 m³/h
Nitrogen Pressure 0.4–0.8 MPa
Nitrogen Consumption Approx. 1.5–2 m³/h
Nitrogen Purity ≥99.999%

Download Datasheet

Additional information
BrandJT
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