JT NIS-450 Selective Soldering Machine

NIS-450 Selective Soldering Machine

NIS-450 Selective Soldering

The JT NIS-450 is an inline selective soldering machine for localized soldering of through-hole components on PCB assemblies. It integrates flux application, preheating, and selective wave soldering in a modular system, making it suitable for THT production and mixed-technology assemblies that require controlled soldering of selected joints.

NIS-450 Selective Soldering Machine accommodates PCBs up to 500 × 450 mm (L × W). Its transport system uses segmented control and unified width adjustment, while an XY fluxing platform and an XYZ soldering platform control the process at the programmed locations. An electromagnetic pump generates the solder wave, and nitrogen protection supports the soldering process.

Inline Selective Soldering Machine

Top hot-air convection and bottom infrared preheating prepare the assembly before soldering, with additional preheating in the soldering zone supplied as standard. PC + PLC control, CCD visualization, and Gerber/image programming give production engineers access to process settings and visual information. Optional equipment can extend programming, maintenance, and data-handling capabilities to suit the selected production configuration.

Key Features JT NIS-450

The modular arrangement brings the main selective soldering stages into one machine. Segmented transport control and coordinated width adjustment support consistent board handling between stages.

The XY spray platform uses a high-frequency solenoid valve and a single spray nozzle in the listed configuration. A 130 μm nozzle tube, 2–8 mm spray width, and ±0.15 mm spray positioning accuracy support targeted flux application. The system accepts no-clean or water-based flux and includes an automatic low-level alarm.

The NIS-450 Selective Soldering Machine has a 500 × 450 mm effective preheating area. Top hot-air convection provides up to 6 kW, while bottom infrared heating provides up to 13.5 kW. PID + SSR control and a power-control mode support process adjustment within the specified ambient-to-250 °C preheating range.

An electromagnetic pump generates the selective solder wave. XYZ platform motion, ±0.15 mm platform positioning accuracy, and adjustable nozzle soldering speed allow engineers to set movement parameters for individual soldering paths. The platform accuracy specification should not be interpreted as a guaranteed solder-joint accuracy.

Additional preheating in the soldering zone is standard for the NIS configuration. It helps maintain the assembly’s thermal condition as the selected joints are soldered.

Nitrogen protection supports the selective soldering process. Pressure sensors provide low-pressure alarms for nitrogen and compressed air; the flux system also monitors low liquid level.

The PC + PLC control system supports online and offline programming, Gerber and image programming, Chinese/English operation, and CCD process visualization. A programming camera and MARK positioning camera are optional.

Optional automatic nozzle cleaning and automatic solder wire feeding can reduce associated manual tasks. An optional barcode reader supports the catalogue’s described data-upload and program-selection workflow. Specific MES interfaces and integration scope must be agreed for the supplied configuration.

Applications – JT Selective Soldering

• Selective soldering of through-hole components on PCB assemblies within the specified board and clearance limits.
• Mixed SMT/THT assembly processes requiring localized soldering after surface-mount assembly.
• Fixture-based inline soldering where controlled transport and repeatable positioning are needed.
• Products requiring programmable flux placement, adjustable preheating, and individually defined soldering paths

JT NIS-450 | THT Selective Soldering

• Controlled flux placement: Programmed application concentrates flux on the required locations.
• Adjustable thermal preparation: Top and bottom preheating and standard soldering-zone preheating support thermal process tuning.
• Repeatable programmed motion: Separate positioning and process-speed settings support consistent execution of soldering paths.
• Practical process setup: Gerber/image programming and CCD visualization help engineers prepare and monitor the process.
• Reduced routine intervention with options: Nozzle cleaning and solder wire feeding can be automated when specified.
• Configuration flexibility: Modular arrangements allow the system to be specified for the production process; cycle time and output depend on the selected configuration and PCB program.

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