OMRON VP-01G | Inline 3D SPI System
OMRON 3D SPI – SMT printing inspection
- PCB capacity up to 510 × 510 mm.
- Selectable inspection resolution down to 5 µm.
- Peak inspection speed up to 9,400 mm²/sec, configuration dependent.
- Dual Projection accuracy within 2% at 3σ.
- Offline programming and compatible printing-process integration.
OMRON 3D SPI | Solder Paste Inspection Machine
OMRON solder paste inspection
OMRON 3D SPI VP-01G checks printed solder paste before component placement. Its 3D inspection supports early identification of printing deviations on densely populated PCB designs.
VP-01G inspection system
Multiple-resolution operation allows inspection settings to follow the deposit requirements. Available line connections extend the system from inspection into printing-process improvement.
Key Features OMRON 3D SPI – Solder Paste Inspection
Hybrid imaging
Phase-shift measurement combines 3D projection with ring illumination.
Warp compensation
Supports inspection of boards with warpage within the specified range.
Programming
GERBER or mount-data workflows and offline preparation support production changeovers.
Printer Feedback and Placement Feed-Forward
With compatible equipment and the required integration, inspection data can support upstream printing adjustments and downstream placement alignment. Confirm the interface scope for the intended line.
OMRON Quality Software Connections
VP-01G inspection system
- Q-upNavi combines inspection results and imagery for process diagnosis. Engineers can review quality changes across inspection stages and investigate recurring defects with better context.
- QupOpti correlates SPI and AOI evidence to optimize inspection thresholds, helping reduce manual setting work and false calls associated with unsuitable criteria.
- QupAuto-I helps identify the production line, model and process needing attention, supporting faster prioritization of quality-improvement work.
Software availability depends on the selected package and connected equipment.
Why Choose the OMRON VP-01G?
The VP-01G is a practical choice when solder paste measurement needs to be connected to production decisions. Its inspection capabilities can be combined with OMRON analysis tools to investigate recurring issues, refine inspection criteria and focus engineering effort where it matters.
Contact Grandil with your PCB dimensions, minimum deposit requirements, cycle-time target and existing line equipment to request a suitable configuration and quotation.
Software and Optional Equipment VP-01G inspection system
Programming uses CKD VPDS, with optional ePM. Statistical analysis uses CKD Realdata. Published options include Closed Loop, Auto Program Launch, Dual Projection, Q-up Opti, area and height reference jigs, ITAC and CE compliance. Confirm the required options when requesting a quotation.
Applications and Production Benefits
Use the VP-01G for post-print quality control in SMT assembly. Foreign-material detection and optional glue inspection broaden its scope. Early defect identification and process feedback can help reduce avoidable rework; results depend on the application and line setup.
Technical Data OMRON 3D SPI
| Parameter | Specification |
| Model | VP-01G |
| Imaging | Monochrome CMOS, global shutter |
| Measurement | Phase Shift + Hybrid Inspection |
| Inspected characteristics | Volume, projection, dimness, area, shift, average height, bridging, missing paste, coplanarity, foreign material; glue optional |
| PCB size | 50 × 50–510 × 510 mm, L size |
| Thickness | 0.3–5.0 mm |
| Board mass | <5 kg |
| Edge clearance | 4 mm minimum |
| Top / bottom clearance | 5 / 30 mm |
| Conveyor elevation | 900 ±20 mm |
| Clamping | Simultaneous side, top and bottom |
| Stopping | Sensor-controlled; no stopper |
| Transfer | Double-side loading/transfer system |
| Warpage | ±5 mm |
| Minimum paste pitch | 50 µm with 100 µm stencil |
| Height resolution | 1 µm |
| Accuracy, 3σ | Dual: within 2%; single: within 3% |
| GR&R | Within 10% |
| Supply | Single-phase AC 200–240 V ±10%; 50/60 Hz ±1 Hz |
| Apparent power | Maximum 1 kVA |
| Air pressure | 0.3–0.4 MPa |
| Dimensions, W × D × H | 938 × 1,191 × 1,480 mm |
| Equipment mass | 600 kg |
Download Datasheet VP-01G Solder Paste Inspection
| Brand | OMRON |
|---|
You must be logged in to post a review.
Reviews
There are no reviews yet.