VT-S1080 | OMRON Automation – PCB Inspection System
VT-S1080
- The VT-S1080 is the world’s most advanced 3D AOI system, designed for maximum System Performance and High-Quality Productivity.
- Designed for flexible manufacturing, saving manpower with innovative AI Programming.
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
3. Visualization of the AI-determined settings
- Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.
- Minimization of programming efforts by quantitative inspection and AI-assisted qualitative inspection.
Equipped with Omron’s own MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Shift) moiré technique, the system achieves highly robust*2 and reliable inspection performance.
2: Strong against noise that effects the judgement of inspection results such as shadows, secondary reflections, abnormal.
It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
- First Pass Yield efficiency up to 99%
- AI-assisted qualitative inspection conforming to international standards
- AI technology to minimize programming and visual inspection efforts
- Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated solder shapes
- Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors
- Realization of Solder Wetting Direction directly relating to IPC Standards
- Innovative AI tools that support skill-less labor-saving tuning
- Full 3D compliance to IPC – based inspection
- Advanced angle-view inspection of hidden solder joints
- Developed with I4.0 in mind for advanced Machine to Machine communication
- Multi-lateral system monitoring and Predictive Maintenance for 100%, utilization for Production
- Global Library to maintain the same quality standard of manufacturing in all global sites
- High reliability OCR / OCV image detection
- Unique Single Hardware across all S10 Series Platform
- Prepared for the next-generation hardware, camera/GPU/PC for higher detectability/speed capability
- Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.
- 1. AI self-optimization
- 2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
- 3. Visualization of the AI-determined settings
- High-precision solder shape reconstruction
- Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.
- M2M*1 system focusing on quality
- 1. Preventing defects by:
- monitoring and reporting fluctuations in the measured values during production
- visualizing defect trends associated with chip mounter hardware such as heads and nozzles
- 2. Visualizing the quality by:
- process comparison
- displaying production status
- linking SPI/AOI/AXI systems
| Type | VT-S1080 | |
| Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm | |
| Weight | Approx. 1250 kg | |
|
Power supply |
Voltage | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% |
| Rated power | 2.0 kVA (Maximum current 10 A) | |
| Line height | 900±20mm | |
| Air supply | Not required | |
| Operating temperature range |
10 to 35°C |
|
| Operating humidity range | 35 to 80% RH (Non-condensing) | |
|
Vision system |
Imaging system | 12M pixel camera |
| Inspection principle | MDMC*1 illumination + 3D reconstruction through MPS*2 technology | |
| Image resolution | 12.5µm | |
| FOV | 50.0 x 37.5mm | |
| Supported PCB size | 50(W) x 50(D)～510(W) x 680(D)mm | |
| Weight | (Max) 4 kg | |
| Thickness | 0.4～4mm | |
|
Clearance |
Above the conveyor belt: 54 mm or less; Below the conveyor belt: 50 mm or less
(Including board thickness/curvature/bend/part tolerance, etc.) |
|
| Height measurement range |
25mm |
|
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