Solder Bar Alloy SN100C
- Finer grain structure and shinier surface than conventional Sn99.3Cu0.7 alloys
- Eutectic alloy (defined melting point at 227°C)
- Reduction of dross formation – saves money
- Very good wetting characteristics
- Highly reduced dissolution rate of copper and other metals in comparison with conventional Sn99Cu1 alloys and as a result significantly increased service lives of the solder baths
- Reduction of defect rate due to much lower tendency to form bridging and icicles
- Optimum working temperatures from 260-270°C
- SN100Ce is the copper-free version of the micro-allying solder. This re-fill solder can be used, if the copper content in used solder baths is too high and needs to be reduced to the accepted level of 0.5-0.9%
The use of SN100C as wave solder requires a solder bath temperature of approx. 260 to 270 °C. The use of inert gas means a significant extension of the process window, but is not necessarily required. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. Bridging and icicle formation is drastically reduced. The dross formation is also considerably minimised. SN100C can also be used at higher temperatures in selective soldering systems.
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