PBT Fa23 Semi Automatic Printer | PBT | SMT Printer

PBT Fa23 Semi Automatic Printer

Fa23 PBT Printer

PBT Fa23

Fa23-max-PCB-smt-microelectronics-stencil-misprint-printing-machines

Fa23-max-area-PCB-smt-microelectronics-stencil-misprint-printing-machines

Fa23-max-size-PCB-smt-microelectronics-stencil-misprint-printing-machines

PBT Fa23

PBT Fa23 Semi Automatic Printer is designed to meet the highest standards of precision and flexibility for small to medium batch production. It is equipped with automatic control of alignment of the stencil apertures relative to the contact pads of the board and a system for cleaning the bottom of the stencil.

Solder paste printing is one of the most important processes in SMT. PBT Fa23 Semi Automatic Printer bring on highly precise print. Designed for accurate and repeatable printing. For any electronic application while maintaining low investment costs.

Two models of Fa23 Printers available to cover complete range of applications

Each model comes as stand-alone with package of selected features

Basic set of adjustable production tooling included

Technical Data

Compact size and small footprint
Quick PCB changes due to convenient drawer
Fast product changeover
Manual or automatic camera guided stencil to pad alignment
Digital filtration of unwanted reflections or shapes on the pads chosen for alignment
X, Y, Theta playless table adjustment
Quick stencil clamping with pneumatic fixation
Three-position squeegee height control for quick stencil changes
Complete set of magnetic PCB fixturing
Support bars adjustable to PCBA thickness
Object space up to component height 63,5 mm
Programmable printing pressure control
Programmable board from stencil separation speed
Adjustable separation distance
Adjustable upper position of the table
Very smooth pneu-hydraulic synchronized table separation motion
Programmable print speed and adjustable squeegee range
Integrated underside cleaning system

APPLICATION

Small to middle series production
Printing solder paste
Printing SMD glue
Printing thermoconductive paste
Print on ceramics, foils, metals
Print area 410×390 mm
Frame capacity 680×584 mm

Fa23 AUTOMATIC

Fa23 AUTOMATIC

Stencil frame size max 584x680x40 mm
Stencil frame size min 584x584x18 mm
Print area max 410×390 mm
PCB size max 460×410 mm
PCB size min 50×60 mm
Machine footprint 860×846 mm
Fully automatic stencil to pad alignment

Fa23 MANUAL

Fa23 MANUAL

Stencil frame size max 584x680x40 mm
Stencil frame size min 584x584x18 mm
Print area max 410×390 mm
PCB size max 460×410 mm
PCB size min 50×60 mm
Machine footprint 860×846 mm
Manual stencil to pad alignment monitored by software

DRAWER WITH UNDERSIDE CLEANING

Fully telescopic drawer carries all the clapming for quick PCBA changes

Simply operated underside cleaning of stencil

FEATURES FOR PRECISION

Solder paste printing is one of the most important processes in SMT

Fa23 Printers bring on highly precise print

Designed for accurate and repeatable printing

For any electronic application while maintaining low investment costs

CAMERA CONTROLLED STENCIL TO PAD ALIGNMENT

Stencil-to-board automatic alignment system with unique through-stencil view technology
Two fixed cameras can be positioned over any suitable position of the print area
System can use square solder pads or printable fiducials
Possible exact positioning of PCB under stencil for stencils with reduced apertures
LED illuminates the target area for a crystal clear view through stencil apertures
A laser source attached to each camera speeds up navigation and camera positioning during setup
First print alignment does not require any calibration to define the stencil position
All to do with the new product is to find the proper apertures for alignment, to show them to the system and start print process
Alignment in just a few seconds thanks to fast and reliable table servo-positioning with MAXON drives

SEPARATION SPEED AND DISTANCE

Successful snap-off depends on solder paste thixotropy, thickness and dynamics of separation movement
Separation of stencil from PCB is driven by pneumatic-hydraulic system which assures very smooth acceleration of printable separation speed
Important for printing of small chips and high-density PCBs
Slow speed for precise separation is programmable as well as the necessary adjustable snap-off distance, so the separation accelerates as soon as possible to minimize PCB removal time
After finishing alignment, the PCB-to-stencil position remains without any movement which assures the highest long-term stability of print accuracy

PROCESS CONTROL FEATURES

Full range of adjustable parameters assure excellent repeatibility of results

Fa23 series provides high level of programmability and parameter control

INTUITIVE TOUCHSCREEN INTERFACE

Controlling and programming uses PC with WINDOWS 7 OS
Possibility of logging all process parameters
Three levels of operational software with password protected access
Programmable print speed and pressure
Digital filtration of non uniform reflection of solder pad surface
Digital filtration of leads belonging to solder pads chosen for alignment

SQUEEGEE PRESSURE AND SPEED

Squeegee pressure and speed are programmable and controlled by software
Dual, friction-free air cylinders assure very precise pressure setting

FLEXIBILITY

PBT Fa23 Semi Automatic Printer come complete with a full supply of magnetic PCB mounting hardware

Wide range of squeegees available

MAGNETIC FIXTURES AND SUPPORT RAILS

Edge support rails simply movable on the table

Precisely adjustable for boards of thicknesses from 0.5 mm to 4 mm

Bottom side support pins and vacuum posts

Fixed position registration pins for PCBs with tooling holes

Same pins can be easily used as additional side support

SQUEEGEES

Easily accessible print head allows quick replacement of squeegee blades
Metal blade squeegees have integral paste deflectors to keep solder paste contained
Blades are available in various widths

3-POSITION SQUEEGEE HEIGHT CONTROL

Unique design of the Fa23 print head allows fast stencil changes without removing its dual squeegees
Production mode of the squeegees is either in the Up position or the Down position within the frame envelope
Up position is designed to keep the solder paste consistent and ready for repeated or next print