koki Leaded Solder Paste SE

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Koki Leaded Solder Paste SE48-M956-2

  • Superior workability, solderability and electrical reliability.
  • Koki no-clean Leaded solder paste.
  • Super Low Void Solder Paste.

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Description

KOKI SE 48 Leaded Solder Paste SE48

 

  • Koki SE48-M956-2 Outstanding continual and intermittent print-ability even with fine pitch pattern (0.4mm pitch, o.25mm∅) applications.
  • Uses carefully classified solder powder with uniform particle size.
  • Applicable for super fine pitch SMT.
  • KOKI Leaded Blue Paste

KOKI SE48

Product Performance

Print-abilityKOKI SE48

Sharp Print Definition

WettabilityKOKI SE48

Excellent wetting

Voiding property (PwTr)Conventional                  SE48-M956-2

Particle size definition

Code 48 58
Particle size (µm) 20 – 45 20 – 38

KOKI SE48

  • older alloy composition is Sn37Pb
  • Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
  • Carefully selected flux chemistry ensures low voids formation.
  • Extremely long stencil idle time and tack time offers a wide process window
  • Low color flux residue offers superior cosmetic appearance.
  • Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
Application Printing – Stencil
Product SE-48-M956-2
Alloy Composition (%) Sn63, Pb37
Melting point (°C) 183
Shape Spherical
Particle size (μm) 20 – 45
Flux Halide content (%) 0.0
Flux type ROL0
Product Flux content (%) 10 ± 0.5
Viscosity*1 (Pa.S) 200 ± 10%
Copper plate corrosion Passed
Tack time > 48 hours
Shelf life (below 10°C) 6 months
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