KOKI Lead Free Low Ag Solder Paste S01XBIG58
KOKI Lead Free Low Ag Solder Paste S01XBIG58
KOKI S01X Lead Free
- PERFECT MELTING and wetting at super fine pitch micro components (>0.25mm dia. CSP, 0603 chip)
- Stable viscosity performance due to prevention with chemical reaction between solder powder and flux.
- Solder alloy composition is Sn 0.1Ag 0.7Cu 1.6Bi +Ni.
KOKI Low Ag Solder Paste
High-reliability Low Ag Lead Free Solder Paste
- Solder alloy composition is Sn 0.1Ag 0.7Cu 1.6Bi +Ni
- KOKI Halogen Free Low Ag Solder Paste
- S01XBIG58-M500-4 Sn 0.1Ag 0.7Cu 1.6Bi + Ni
Achieved joint reliability superior to SAC305
The only difference from SAC305 is “low cost”
A very small amount of two modifying elements Bi and Ni are added.
Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.
Click here for the mechanism of hybrid reinforcement.
■ Alloy matrix
Maintains thermal-fatigue resistance for a long time
IMCs containing Ni (yellow points in the diagram on the right) finely disperse among Sn crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction from SAC305 also for its “long-lasting robustness” not just temporary withstandability.
■ Solder joint diagram (After 1500 cycles of -30 +/-80℃)
Achieved both low-Ag and halogen-free
KOKI strives to respond to customers’ requests for cost cutting and to become, as a company that sets a high value on environmental conservation, a good partner of all customers who are considerate to the environment.
Therefore, all our low Ag products have halogen free versions in their line-up.
KOKI Low Ag Solder Paste
Solder alloy composition is Sn 0.1Ag 0.7Cu 1.6Bi +Ni.
- PERFECT MELTING and wetting at super fine pitch micro components (>0.25mm dia. CSP, 0603 chip)
- Stable viscosity performance due to prevention with chemical reaction between solder powder and flux.
- Low solidus point (211ºC) may allow to apply the CONVENTIONAL reflow profile for SAC305.
- Conforms to HALOGEN FREE standard (Cl+Br = Less than 1500ppm) BS EN14582.
- HIGH RELIABILITY Low-Ag Alloy compared with conventional low-Ag alloys.
| Application | Printing – Stencil | |
| Product | S01XBIG58-M500-4 | |
| Alloy | Composition (%) | Sn 0.1Ag 0.7Cu 1.6Bi +Ni |
| Melting point (°C) | 211 – 227 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 11.2 ±1.0 |
| Viscosity*1 (Pa.S) | 220 ± 30 | |
| Copper plate corrosion | Passed | |
| Tack time | > 48 hours | |
| Shelf life (below 10°C) | 6 months | |
| Optional powder size (µm) | 20 ~ 45: S01XBIG48-M500-4 | |
| Brand |
KOKI |
|---|
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