Non-contact jet dispensing applicable solder paste
E150DN series Sn 3.0Ag 0.5Cu
“JET” brings about various advantages
Consistently Deposited Solder
Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint.
Stable Solder Paste Shape
Configuration of dispensed solder paste is stable all the way through in jet dispensing, as the process does not involve a nozzle contact which is responsible for causing bridges.
Achieves High Precision Dispensing
E150DN Series wipes out concerns with jet dispensing of solder paste such as clogging of needles, solder icicle, and spattering by optimizing size of solder powder and viscosity, and adjusting thixotropy.
Product Performance Table
|Product Name||E150DN series||Product Category||Solder Paste|
|Flux Type||ROL0 (IPC J-STD-004A)||Melting Point(℃)||217-219|
|Particle Size（μm）||58:20-38 / 70:10-25 / 811:5-20 / 012:2-10||Viscosity（Pa.s）||40|
|Flux Content(%)||15.0||Halide content(%)||0|
|Flux Type||ROL0 (IPC J-STD-004A)|