Soldering Pastes – High-stability SMT solder paste

KOKI supplies both lead containing and lead-free solder pastes in various particle sizes and packaging (e.g. jars and cartridges) for a wide range of application. We offer eutectic silver containing, low-silver and low temperature pastes specifically developed for lead-free application.

  • KOKI solder paste designed for high-precision SMT printing, stable viscosity, excellent wetting, and IPC-compliant performance. Official distributor.
  • KOKI Solder Paste is recognized worldwide for its outstanding stability, reliability, and print consistency in SMT production. Engineered with advanced formulation, KOKI solder pastes deliver superior stencil release, controlled viscosity, low slump, and excellent reflow performance across a wide range of components, including fine-pitch and ultra-miniature parts.

This category includes both lead-free and leaded KOKI solder pastes with SAC-based alloys, optimized melting characteristics, minimal solder balling, and strong wetting on various surface finishes.

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KOKI Dispensing Solder Paste

KOKI Lead Free Soldering Paste

KOKI Leaded Soldering Paste

KOKI Solder Paste - Best Solder Paste for Stencil Printing

Lead-Free Solder Paste

  • Lead-free solder pastes, commonly formulated with SAC alloys such as SAC305 (Tin–Silver–Copper), comply with RoHS environmental standards. They are widely used in modern SMT production, offering high mechanical strength, excellent reliability, and stable reflow performance.

Leaded Solder Paste

  • Leaded solder pastes, typically based on Sn63/Pb37 alloy, have a lower melting point and very smooth wetting behavior. They are ideal for non-RoHS applications, repairs, and industries that require lower thermal stress during soldering.