KOKI Leaded Soldering Paste
KOKI leaded soldering paste Printing Performance
Key Features of KOKI Leaded Solder Paste
- Excellent wetting on various surfaces
- Uniform and stable printing with no stencil clogging
- Stable rheology with consistent viscosity during long print runs
- Low spattering and minimal solder balling during reflow
- Long stencil life for continuous production
- High environmental stability and slow drying behavior
KOKI leaded soldering paste, Superior workability, solderability and electrical reliability.
KOKI Soldering Materials – Available in 3 alloy:
- Regular leaded solder paste – Sn63Pb37
- Leaded with 2% Ag solder paste – Sn62Pb36Ag2
- Antimuon (Sb) Solder Paste – Sn62.6Pb36.8Ag0.4Sb0.2
Top Advantages for SMT Production Lines - Stencil Printing Solder Paste KOKI
- Reduced printing defects such as bridging, cold joints, and solder balling
- Ideal for fine-pitch components including 0402, 0201, and BGA
- Outstanding performance on high-speed SMT lines with no special adjustments
- Reduced line downtime due to less stencil cleaning
- Improved overall yield and final assembly quality
