KOKI Lead Free Solder Paste S3X58 (SAC305)
Description
KOKI Powerful Wetting General Purpose Solder Paste
S3X58-M500C-7Sn 3.0Ag 0.5Cu
Good and Consistent Wetting
Spreading to Oxidized Metal Surface.
Activator Technique
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Low Voiding Technique
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Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
Test condition
・ Stencil : 200μm / 6.5mmφ aperture
・ Pre-conditioning : 150ºC for 16Hr
・ Heat source : Convection reflow
・ Reflow : Air
Product Performance Table
| Product Name | S3X58-M500C-7 | Product Category | Solder Paste | |
| Composition | Sn 3.0Ag 0.5Cu | Melting Point(℃) | 217-219 | |
| Particle Size（μm） | 20-38 | Viscosity（Pa.s） | 200 | |
| Flux Content(%) | 11.8 | Halide content(%) | 0 | |
| Flux Type | ROL0 (IPC J-STD-004) | |||
Additional information
| Brand |
KOKI |
|---|
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