KOKI Dispensing Low Curing Temperature SMT Adhesive
Description
Low curing temperature SMT adhesive
JU-90-2LTH
Energy-saving adhesive curing
at 90℃ Reduces thermal stress
Environmental and energy-saving
Lower curing temperature contributes to reducing energy consumption and cost, which results in less CO2 emissions.
■ Electricity consumption of curing oven / hr.
Reduces oxidation of components and substrate
JU-90-2LTH cures at temperatures as low as 90ºC, reducing the level of oxidation for the components and substrate. It enables improvement in the overall product quality and the first time quality.
■ Influence of heat damage
As strong as conventional models
The most important element of adhesive is the bonding strength. JU-90-2LTH reduces the curing temperature without sacrificing its bonding strength.
■ Bonding strength cured at 90℃
Product Performance Table
| Product Name | JU-90-2LTH | Product Category | Heat curing type SMT adhesive | |
| Composition | Epoxy | State / Color | Paste / Red | |
| Viscosity（Pa.s） | 65 | Transition Temperature(℃) | 49〜74 | |
| Curing condition | 90℃ × >90sec. | Shelf life (0-10℃) | Below 10ºC, 6 months |
Additional information
| Brand |
KOKI |
|---|
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