KOKI SE 48 Leaded Solder Paste SE48
Product Performance
Print-ability
Sharp Print Definition
Wettability
Excellent wetting
Voiding property (PwTr)Conventional SE48-M956-2
Particle size definition
- older alloy composition is Sn37Pb
- Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
- Carefully selected flux chemistry ensures low voids formation.
- Extremely long stencil idle time and tack time offers a wide process window
- Low color flux residue offers superior cosmetic appearance.
- Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
Application | Printing – Stencil | |
Product | SE-48-M956-2 | |
Alloy | Composition (%) | Sn63, Pb37 |
Melting point (°C) | 183 | |
Shape | Spherical | |
Particle size (μm) | 20 – 45 | |
Flux | Halide content (%) | 0.0 |
Flux type | ROL0 | |
Product | Flux content (%) | 10 ± 0.5 |
Viscosity*1 (Pa.S) | 200 ± 10% | |
Copper plate corrosion | Passed | |
Tack time | > 48 hours | |
Shelf life (below 10°C) | 6 months |
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