FUJI NXT III | Fuji Scalable Placement Platform
For multi functional and powerful electronics such as mobile phones and automotive applications, both the number of components to be assembled, as well as the possible functionalities further increased. Accordingly, the mounting density of tiny components increases sharply. On the other hand show requirements, such as the loading of shielding plates, components with very small connection pitch and components of package on package applications that the demands on the functionality of assembly machines are becoming more demanding year after year.
The NXT III was developed as a scalable placement platform that ensures both high productivity and quality, which also meets the requirements of future device generations, as is 03015 requirements.
FUJI NXT-H , Inherits concepts from the NXT-series which is a best selling SMT mounter.
- Modular concept that supports a wide variety of production types
- Automatic nozzle exchange
- Can load dies and SMDs using various supply packaging
- Supports flip chips and face-up supply Supplies up to 25 different wafers
- Automatic exchange of pusher pots